Thermal management of electronic devices and systems

Results: 198



#Item
51Low Cost, High Performance, High Volume Heatsinks Kurtis Keller Computer Science – Microelectronics Systems Laboratory University of North Carolina at Chapel Hill, USA ABSTRACT Higher-powered electronics are being inte

Low Cost, High Performance, High Volume Heatsinks Kurtis Keller Computer Science – Microelectronics Systems Laboratory University of North Carolina at Chapel Hill, USA ABSTRACT Higher-powered electronics are being inte

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Source URL: www.cs.unc.edu

Language: English - Date: 1998-06-11 16:33:26
52The 31st Annual Thermal Measurement, Modeling and Management Symposium March 15-19, 2015 DoubleTree by Hilton Hotel San Jose 2050 Gateway Place, San Jose, California

The 31st Annual Thermal Measurement, Modeling and Management Symposium March 15-19, 2015 DoubleTree by Hilton Hotel San Jose 2050 Gateway Place, San Jose, California

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Source URL: www.semi-therm.org

Language: English - Date: 2015-03-08 23:03:04
53Microsoft Word - YGA资料.doc

Microsoft Word - YGA资料.doc

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Source URL: www.standardpcb.com

Language: English - Date: 2011-09-16 22:46:31
54Unick Chemical Corp. Silicon-based compound for thermo coupling of electronic components and heat sinks. High-heat conductive property allows heat to pass freely where heat dissipation and dispersion is important.  Tempe

Unick Chemical Corp. Silicon-based compound for thermo coupling of electronic components and heat sinks. High-heat conductive property allows heat to pass freely where heat dissipation and dispersion is important. Tempe

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Source URL: www.mantech.co.za

Language: English - Date: 2008-10-16 11:11:40
55Mobile Networks and Applications[removed]–13  3 Heat dissipation in wearable computers aided by thermal coupling with the user

Mobile Networks and Applications[removed]–13 3 Heat dissipation in wearable computers aided by thermal coupling with the user

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Source URL: cba.mit.edu

Language: English - Date: 2011-12-13 18:32:02
56http://www.electronics-cooling.com/html/2000_sep_a4.html

http://www.electronics-cooling.com/html/2000_sep_a4.html

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Source URL: www.mhtlab.uwaterloo.ca

Language: English - Date: 2004-10-21 11:53:47
57STI 30th Anniversary Logo

STI 30th Anniversary Logo

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Source URL: www.solderingtech.com

Language: English - Date: 2012-12-20 16:34:14
58Environment-Friendly Vertical Air-Cooling Heatsink: Heatpipe-Based Heatsink “POWER KICKER®” by Takeshi Takahashi * , Kazuhiro Konishi * , Junji Sotani * , Takayuki Kikuchi * 2 , Satoru Isogai * 3 and Yuichi Kimura *

Environment-Friendly Vertical Air-Cooling Heatsink: Heatpipe-Based Heatsink “POWER KICKER®” by Takeshi Takahashi * , Kazuhiro Konishi * , Junji Sotani * , Takayuki Kikuchi * 2 , Satoru Isogai * 3 and Yuichi Kimura *

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Source URL: www.furukawa.co.uk

Language: English - Date: 2015-02-11 12:14:08
59MG_Boilerplate12-WP Custom MAD

MG_Boilerplate12-WP Custom MAD

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Source URL: s3.mentor.com

Language: English - Date: 2014-07-17 18:10:51
60Vehicle Thermal Management Simulation at TARDEC Scott Shurin[removed]removed] UNCLASSIFIED: Distribution A: Approved for public release

Vehicle Thermal Management Simulation at TARDEC Scott Shurin[removed]removed] UNCLASSIFIED: Distribution A: Approved for public release

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Source URL: www.cd-adapco.com

Language: English - Date: 2013-03-22 16:11:26